Main Products

 

PRODUCT TYPES

■ precision mold components for digital equipment
digital camera lens barrel mold components, ink-jet printer head mold components as well as mobile phone and tablet mold components

■ precision mold components for automobiles
precision mold components used to connect electrical equipment, other precision mold components for fuel pumps and exhaust gas filters

■ precision mold components for Semiconductors

Semiconductor (LED, LSI, IC, transistors, diodes) sealing moldings.

also: optical fiber connector, ultra-precision mold components, such as optical data links


 

Material

NAK80 HPM38 ELMAX STAVAX ASP23 HAP72 A7075 and others

Dimensional Precision

±0.001mm~±0.005mm

Maximum Work Size

300 × 200 × 120mm

 

■ mold components for medical devices and pharmaceuticals
   precision mold components used for transfusions, components for medical micro-needles

■ office supplies related mold components
writing instrument mold components, such as ball-point pens

■ others
metal Yo-Yo, custom frame production e.g. for competitions
All of them were sold to yoyorecreation.

 

Product List

MEDICAL MICRO-NEEDLE MOLDMaterial: SUS

MEDICAL MICRO-NEEDLE MOLD

Material: SUS

FILTER MOLD COMPONENTMaterial: CuW

FILTER MOLD COMPONENT

Material: CuW

LED MOLD COMPONENTMaterial: STAVAX Hardness: HRC58

LED MOLD COMPONENT

Material: STAVAX
Hardness: HRC58

INSERT RINGMaterial: ELMAX Used in molds for medical devices

INSERT RING

Material: ELMAX
Used in molds for medical devices

PUNCHMaterial: SKD11

PUNCH

Material: SKD11

PUNCHER TO PIRCE FILMSMaterial: HAP40 Hardness: HRC64

PUNCHER TO PIRCE FILMS

Material: HAP40
Hardness: HRC64

HELICAL RINGMaterial: SUP10 Special spring used in assembly equipment

HELICAL RING

Material: SUP10
Special spring used in assembly equipment

PLASTIC PARTMaterial: PEEK Used in medical applications. Excellent heat and chemical resistance.

PLASTIC PART

Material: PEEK
Used in medical applications. Excellent heat and chemical resistance.

SEMICONDUCTOR MOLD COMPONENTMaterial: PD613 Hardness: HRC62

SEMICONDUCTOR MOLD COMPONENT

Material: PD613
Hardness: HRC62

COPPER ALLOY COREMaterial: Beryllium Copper (COOLMPOULD) heat spot cooling  measure for high cycle molding

COPPER ALLOY CORE

Material: Beryllium Copper (COOLMPOULD)
heat spot cooling measure for high cycle molding

MICRONEEDLESMaterial: Silicone (PDMS) Used in pharmaceutical device

MICRONEEDLES

Material: Silicone (PDMS)
Used in pharmaceutical device

HIGH PRECISION MOLDSMaterial: STAVAX HRC52 Used in the production of infusion pipes of IV drips

HIGH PRECISION MOLDS

Material: STAVAX HRC52
Used in the production of infusion pipes of IV drips

MANDREL FOR EXTRUSION

MANDREL FOR EXTRUSION

MEDICAL FORCEPSMaterial: SUS316

MEDICAL FORCEPS

Material: SUS316

GAUGES FOR CAPSULE WEIGHTS

GAUGES FOR CAPSULE WEIGHTS

 

Precision Metal Parts Manufacturing
Equipment Parts
Jig Design Manufacturing
3D Machining Data Manufacturing

Tel: 059-252-1100 | Fax: 059-252-1178
info@tokai-azumi.co.jp
578 Nakamura-Cho, Tsu, Mie 514-1256, Japan